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Rigorous Simulation of Lithographic Exposure of Photoresist over a Nonplanar Wafer

: Erdmann, A.; Kalus, C.


Righini, G.C. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.; International Commission for Optics -ICO-:
Optics for the quality of life. 19th Congress of the International Commission for Optics 2002. Pt.2 : 25 - 30 August 2002, Firenze, Italy
Bellingham, WA: SPIE, 2003 (SPIE Proceedings Series 4829)
ISBN: 0-8194-4596-7
International Commission for Optics (Congress) (ICO) <19, 2002, Firenze>
Conference Paper
Fraunhofer IIS ()

Lithographic exposures belong to the most critical process steps in the manufacturing of microelectronic circuits. Almost all exposures are performed over nonplanar wafers. The backscattering of light from topographic features on these wafers is of increasing concern for the accuracy and stability of lithographic processes. We combine standard imaging theory and finite-difference time-domain (FDTD) algorithms to simulate several typical geometries. Consequences with respect to typical lithographic process parameters are discussed.