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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Medical implants and other biomedical devices using microflex interconnection technologies

 
: Meyer, J.-U.; Schüttler, M.; Haberer, W.; Dörgen, T.; Stieglitz, T.

International Microelectronics and Packaging Society -IMAPS-:
International Conference on Advanced Packaging and Systems 2002. Proceedings : March 10 - 13, 2002, Reno Hilton Hotel, Reno, Nevada
Washington: IMAPS, 2002 (SPIE Proceedings Series 4828)
ISBN: 0-930815-65-3
ISBN: 0-8194-4595-9
pp.198
International Conference on Advanced Packaging and Systems (ICAPS) <2002, Reno/Nev.>
English
Conference Paper
Fraunhofer IBMT ()

: http://publica.fraunhofer.de/documents/N-170261.html