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Foreword special section on micro- and nanoscale packaging
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2005
Journal Article
Titel
Foreword special section on micro- and nanoscale packaging
Author(s)
Lee, Y.C.
Chiou, J.A.
Velten, T.
Hancock, W.O.
Zeitschrift
IEEE transactions on advanced packaging
DOI
10.1109/TADVP.2005.860786
Language
English
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Fraunhofer-Institut für Biomedizinische Technik IBMT