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Test boards simplify flip chip underfill processing

 
: Becker, K.-F.; Adams, T.

SMT Surface Mount Technology Magazine 15 (2001), No.3, pp.51-52,54
ISSN: 1529-8930
English
Journal Article
Fraunhofer HHI ()

Abstract
Flip chip packages offer a very high level of input/output (I/O) density together with miniaturization, a combination that makes them very attractive for a growing number of applications. Still, though, designing the encapsulation process for a new flip chip can be a complex, costly and time-consuming experience. By using it with nondestructive micro-imaging, test boards can cut costs and complexity by rendering results acoustically visible.

: http://publica.fraunhofer.de/documents/N-169798.html