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Thermal characterization of an all-active microring resonating laser

: Fleischer, A.S.; Harnacher, M.; Troppenz, U.; John, W.

American Society of Mechanical Engineers -ASME-, Heat Transfer Division:
Proceedings of the ASME Heat Transfer Division 2004. Presented at 2004 ASME International Mechanical Engineering Congress and Exposition. Vol.2: Heat transfer equipment, heat transfer in electronic equipment, heat transfer in energy systems, heat transfer in multiphase systems, low temperature heat transfer : November 13 - 19, 2004, Anaheim, California, USA
New York/NY.: ASME, 2004
ISBN: 0-7918-4711-X
ISBN: 0-7918-4178-2
ISBN: 0-7918-4180-4
International Mechanical Engineering Congress and Exposition (IMECE) <2004, Anaheim/Fla.>
Conference Paper
Fraunhofer IZM ()
Fraunhofer HHI ()

Active microring optical devices are promising candidates for use in next generation optical signal processing and sensor products. In this design, an InP based microring laser is vertically coupled to a passive feeding waveguides using a waferbonding technology. The vertical coupling is expected to detrimentally affect the operating temperature and device performance through the low thermal conductivity of the bond material. Thus, a thermal analysis is undertaken in the design stage to better understand the implications of this fabrication process. A thermal analysis of a basic microring resonator of 50 m radius and 100 mW power dissipation is presented and thermal design variations are discussed.