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The ICT-BOOM project: Photonic routing on a silicon-on-insulator hybrid platform

 
: Stamatiadis, C.; Stampoulidis, L.; Vyrsokinos, K.; Lazarou, I.; Zimmermann, L.; Voigt, K.; Moerl, L.; Kreissl, J.; Sedighi, B.; Sheng, Z.; Heyn, P. de; Thourhout, D. van; Karl, M.; Wahlbrink, T.; Bolten, J.; Leinse, A.; Heidemann, R.; Gomez-Agis, F.; Dorren, H.J.S.; Pagano, A.; Riccardi, E.; Avramopoulos, H.

15th International Conference on Optical Network Design and Modeling, ONDM 2011 : 8.-10. Feb. 2011, Bologna
2011
ISBN: 978-3-901882-42-5
ISBN: 978-1-424-49596-2 (online)
Art. 5753413
Optical Network Design and Modeling (ONDM) <15, 2011, Bologna>
English
Conference Paper
Fraunhofer HHI ()

Abstract
BOOM is a photonic integration concept that aims to develop compact, cost-effective and power efficient silicon photonic components for high capacity routing functionalities. To accomplish this, flip-chip bonding and heterogeneous wafer scale fabrication techniques are employed that enable Si manufacturing with III-IV material processing. We present in this paper the second generation of BOOM devices that perform all-optical wavelength conversion, label processing and switching on SOI nano-wire boards.

: http://publica.fraunhofer.de/documents/N-169466.html