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Fabrication of metrology test structures for future technology nodes using high resolution variable-shaped E-Beam direct write

 
: Szikszai, L.; Jaschinsky, P.; Keil, K.; Hauptmann, M.; Mört, M.; Seifert, U.; Hohle, C.; Choi, K.-H.; Thrum, F.; Kretz, J.; Paz, V.F.; Boef, A.D.

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Schellenberg, F.M. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Alternative lithographic technologies. Proceedings. Pt. 1 : 24 - 26 February 2009, San Jose, California, United States
Bellingham, WA: SPIE, 2009 (SPIE Proceedings 7271)
ISBN: 978-0-8194-7524-4
Art. 72712M
Conference on Alternative Lithographic Technologies <2009, San Jose/Calif.>
English
Conference Paper
Fraunhofer CNT ()

Abstract
Electron beam direct write (EBDW) can be utilized for developing metrology methods for future technology nodes. Due to its advantage of high resolution and flexibility combined with suitable throughput capability, variable-shaped E-Beam lithography is the appropriate method to fabricate sub 40nm resist structures with accurately defined properties, such as critical dimension (CD), pitch, line edge roughness (LER) and line width roughness (LWR). In this study we present results of exposure experiments intended to serve as an important instrument for testing and fitting various metrology and defect density measurement methods for future technology nodes. We successfully fabricated sub 40nm gratings with varying CD, pitch, programmed defects and LER/LWR. First metrology measurements by means of optical scatterometry on these dense structures show that variation of the signal response is sufficient to detect sub 10nm fluctuations with a satisfying repeatability.

: http://publica.fraunhofer.de/documents/N-169027.html