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Micro- and nanomaterials characterization by image correlation methods

: Vogel, D.; Gollhardt, A.; Michel, B.


Sensors and Actuators. A 99 (2002), No.1-2, pp.165-171
ISSN: 0924-4247
Journal Article
Fraunhofer IZM ()
micro material; Nanomaterial; deformation analysis; image correlation method; localized correlation analysis; load state image; displacement field; strain field; Scanning Electron microscope; scanning force microscope; object load response; microscopic material area; nanoscopic material area; deformation mapping; thermo-mechanical material property; strain field mapping; coefficient of thermal expansion; Poisson ratio; mechanical testing; thermal testing; electronic packaging; microsystem packaging; chip scale packaging; CTE measurement; atomic force microscope imaging

The authors present a new approach to deformation analysis based on localized correlation analysis on load state images. Displacement and strain fields are extracted from images, originating from different kinds of high resolution equipment, e.g. scanning electron and scanning force microscopes. As a result, object load response can be recorded within microscopic or nanoscopic material areas. This unique technique is utilized for deformation mapping as well as for direct determination of thermo-mechanical material properties. The method has been established as microDAC/nanoDAC for strain field mapping and as mTest for the measurement of material properties, currently coefficients of thermal expansion (CTE) and Poisson ratios. This paper includes an introduction to the measurement technique, a view on the method's capability and the developed hardware for mechanical and thermal testing. The application of the tools is illustrated by examples from electronics and microsystem packaging. Deformation measurements on chip scale packages and measurement of CTE are discussed in detail. Front-end application of correlation techniques using atomic force microscope imaging is demonstrated.