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Generic packaging concepts in the frame of network of excellence ePIXnet

: Tekin, T.; Zimmermann, L.; Schröder, H.; Dumon, P.; Bogaerts, W.; Galan, J.V.; Sanchis, P.; Whelan-Curtin, W.; Beggs, D.


Broquin, J.-E. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Integrated optics: Devices, materials, and technologies XIV : 25 - 27 January 2010, San Francisco, California, United States
Bellingham, WA: SPIE, 2010 (Proceedings of SPIE 7604)
ISBN: 978-0-8194-8000-2
Paper 76040I
Conference "Integrated Optics - Devices, Materials, and Technologies" <14, 2010, San Francisco/Calif.>
Photonics West Conference <2010, San Franciso/Calif.>
Conference Paper
Fraunhofer IZM ()

Generic packaging concepts for silicon photonics have been developed in the frame of EU-funded Network of Excellence ePIXnet (FP6). Three approaches for Silicon photonic packaging will be presented within this paper. Two concepts provide solutions for fiber array coupling to high-index contrast photonic wire waveguide gratings. Third concept is the integration of inverted taper-based fiber coupling structure with silicon etched V-grooves. Using standardized SOI chip designs and commercial available assembly parts, the packaging concepts allow for small footprint or flexible use in an R&D environment. The work presented here has resulted from cooperation within the European Network of Excellence ePIXnet.