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Packaging of MEMS/MOEMS and nanodevices: Reliability, testing, and characterization aspects

 
: Tekin, T.; Ngo, H.-D.; Wittler, O.; Bouhlal, B.; Lang, K.-D.

:

Garcia-Blanco, S. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Reliability, packaging, testing and characterization of MEMS/MOEMS and nanodevices X : 24 - 25 January 2011, San Francisco, California, United States; organized as a part of SPIE Photonics West' MOEMS-MEMS Symposium
Bellingham, WA: SPIE, 2011 (Proceedings of SPIE 7928)
ISBN: 978-0-8194-8465-9
Paper 792805
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices Conference <10, 2011, San Francisco/Calif.>
Photonics West Conference <2011, San Franciso/Calif.>
MOEMS-MEMS Symposium <2011, San Francisco/Calif.>
English
Conference Paper
Fraunhofer IZM ()

Abstract
The last decade witnessed an explosive growth in research and development efforts devoted to MEMS devices and packaging. The successfully developed MEMS devices are, for example inkjet, pressure sensors, silicon microphones, accelerometers, gyroscopes, MOEMS, micro fuel cells and emerging MEMS. For the next decade, MEMS/MOEMS and nanodevice based products will penetrate into IT, telecommunications, automotive, defense, life sciences, medical and implantable applications. Forecasts say the MEMS market to be $14 billion by 2012. The packaging cost of MEMS/MOEMS products in general is about 70 percent. Unlike today's electronics IC packaging, their packaging are custom-built and difficult due to the moving structural elements. In order for the moving elements of a MEMS device to move effectively in a well-controlled atmosphere, hermetic sealing of the MEMS device in a cap is necessary. For some MEMS devices, such as resonators and gyroscopes, vacuum packaging is required. Usually, the cap is processed at the wafer level, and thus MEMS packaging is truly a wafer level packaging. In terms of MEMS/MOEMS and nanodevice packaging, there are still many critical issues need to be addressed due to the increasing integration density supported by 3D heterogeneous integration of multi-physic components/layers consisting of photonics, electronics, rf, plasmonics, and wireless. The infrastructure of MEMS/MOEMS and nanodevices and their packaging is not well established yet. Generic packaging platform technologies are not available. Some of critical issues have been studied intensively in the last years. In this paper we will discuss about processes, reliability, testing and characterization of MEMS/MOEMS and nanodevice packaging.

: http://publica.fraunhofer.de/documents/N-168012.html