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Parameterized FE-modeling and interfacial fracture toughness investigations towards reliability enhancements of advanced plastic packages
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parameterized FE-modeling
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interfacial fracture toughness
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reliability enhancement
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plastic package
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package damage
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package fatigue
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package failure
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MEMS packaging
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harsh environmental condition
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extreme temperature
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thermomechanical reliability
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industrial application
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residual stress
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inhomogeneity
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manufacturing process
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microelectronic package
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Young's Modul
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thermal expansion coefficient
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interface delamination
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chip cracking
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solder interconnect fatigue
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design optimization
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nonlinear FEA
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fracture mechanic
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sensitivity analysis
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material parameter
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geometrical boundary condition
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physical boundary condition
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thermo-mechanical reliability
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parameterized finite element modeling technique
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damage evaluation
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mixed mode interface delamination phenomenal
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solder joint thermal fatigue
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gray scale correlation method
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meshing technique
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failure mechanism
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microcomponent
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parameterized modeling