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Micro Materials Center Berlin: Reliability research for MEMS

 
: Michel, B.; Winkler, T.

Meyendorf, N.; Baaklini, G.Y.; Michel, B. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Nondestructive evaluation and reliability of micro- and nanomaterial systems : 18 - 19 March 2002, San Diego, USA
Bellingham/Wash.: SPIE, 2002 (SPIE Proceedings Series 4703)
ISBN: 0-8194-4451-0
pp.114-119
Conference "Nondestructive Evaluation and Reliability of Micro- and Nanomaterial Systems" <2002, Newport Beach/Calif.>
English
Conference Paper
Fraunhofer IZM ()
electronic packaging; MEMS; survey; advanced interconnection technology; chip size packaging; BGA; wafer level packaging; material research; automotive system; telecommunication system; reliability gap; microsystem reliability; high temperature electronic; Pb-free solder application; polytronic; micromechatronic

Abstract
The paper presents some recent results obtained in the field of electronic packaging for MEMS. A survey is given concerning advanced interconnection technologies (chip size packaging, BGA, wafer level packaging etc.) taking into account new developments in the field of materials research for packaging in various applications, e.g. in automotive and telecommunication systems. Special attention will be given to overcome the reliability gap which can be found in the field of microsystem reliability (e.g. high temperature electronics, lead-free solder applications in MEMS etc. New fields of applications are dealt with e.g. polytronics, micromechatronics.

: http://publica.fraunhofer.de/documents/N-16739.html