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  4. Determination of packaging material properties utilizing image correlation techniques
 
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2002
Journal Article
Title

Determination of packaging material properties utilizing image correlation techniques

Abstract
Thermo-mechanical reliability in advanced electronic packaging requires new materials testing approaches. The necessary understanding of the impact of very local material stressing on component reliability leads to the need of materials testing and characterization on microscopic scale. For example, defect initiation and propagation in multilayer structures as in WLP and flip chip technology, the influence of material migration to mechanical behavior or defect development in ultra-thin silicon dies often are not well understood. A key for micro materials testing and characterization is the measurement of strains and displacements inside microscopic regions. Correlation techniques (e.g., microDAC, nanoDAC) are one of the promising tools for that purpose. Their application potentials to micro testing for electronic packaging materials are demonstrated in the paper. More in detail, CTE measurement and crack testing are discussed. First attempts for testing under AFM conditions and their results are considered
Author(s)
Vogel, D.
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Kühnert, R.
Dost, M.
Michel, B.
Journal
Journal of electronic packaging  
DOI
10.1115/1.1506698
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Keyword(s)
  • image correlation techniques

  • thermo-mechanical reliability

  • component reliability

  • defect initiation

  • defect propagation

  • multilayer structures

  • WLP

  • flip chip technology

  • micro materials testing

  • strain measurement

  • displacement measurement

  • microscopic regions

  • microDAC

  • nanoDAC

  • CTE measurement

  • crack testing

  • AFM testing

  • atomic force microscope

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