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New methods to calibrate simulation parameters for chemically amplified resists

 
: Tollkuehn, B.; Erdmann, A.; Kivel, N.; Robertson, S.A.; Kang, D.; Hansen, S.G.; Fumar, P.A.; Tsann, B.C.; Hoppe, W.

:

Yen, A. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Optical microlithography XV. Vol.2 : 5 - 8 March 2002, Santa Clara, USA
Bellingham/Wash.: SPIE, 2002 (SPIE Proceedings Series 4691)
ISBN: 0-8194-4437-5
pp.1168-1179
Conference "Optical Microlithography" <15, 2002, Santa Clara/Calif.>
English
Conference Paper
Fraunhofer IIS B ( IISB) ()
chemically amplified resist; simulation parameters calibration; predictive process simulation; modeling option; diffusion kinetic reaction coupling; quencher base event sequence; Hinsberg model; diffusion mode; Fickian model; linear diffusion model; development rate model; enhanced notch model; line-width; semidense feature; dense feature; full resist profile; Shipley resist UV 113; parameter extraction procedure; exposure kinetic; acid base neutralization

Abstract
In this paper we examine new models and the indispensability of model parameters of chemically amplified resists (CAR) for their usage in predictive process simulation. Based on a careful exploration of different modeling options we calibrate the model parameters with different experimental data. Furthermore, we investigate different modeling approaches: (1) Mode of coupling between diffusion and kinetic reactions, sequence of quencher base events (Hinsberg model); (2) Mode of diffusion: Fickian and linear diffusion models; (3) Development rate model: Performance of the Enhanced Notch model. The resulting models are evaluated with respect to their performance by comparing with experimental line-width for semidense (1-2, 1-1.6, 1-1.4, 1-1.2) and dense features, the bias between different features and full resist profiles. The investigations are applied to the Shipley resist UV TM 113. Finally, a parameter extraction procedure for chemically amplified resists is proposed.

: http://publica.fraunhofer.de/documents/N-16608.html