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Advanced modular micro-production system

Modulares Miniaturisiertes Produktionssystem
: Gaugel, T.; Neugebauer, J.-G.; Schraft, R.D.

Reichl, H.:
Micro System Technologies 2001 : International Conference & Exhibition on Micro-Electro-, -Opto-, -Mechanical Systems and Components, Düsseldorf, March 27 - 29, 2001
Berlin: VDE-Verlag, 2001
ISBN: 3-8007-2601-7
International Conference on Micro-, Electro-, Opto-, Mechanical Systems and Components <2001, Düsseldorf>
Conference Paper
Fraunhofer IPA ()
Baukastenkonzept; miniaturized production platform; interface; prototype; kit concept; Fertigungssystem; Miniaturisierung; Prototyp; Schnittstelle

The increasing miniaturization of mechanical and electronic components demands adapted manufacturing techniques for production and assembly. The costly conversion procedures, the large amount of space required by current systems and machinery and the limited economical feasibility in producing micro-components were all critical points in the Fraunhofer IPA's research activities. Within the scope of an internal interim research project, an overall concept for a modular miniaturized fab was conceived and developed.
First of all, in order to determine the production-related criteria and requirements of a miniaturized fab (MIF), a wide-ranging analysis of micro-products already on the market and of prototypes almost ready to be marketed was carried out. The main points considered here were manufacturing data, production and jointing methods used, materials, the structure of sets of components, and the geometry of parts.
Based on the knowledge obtained from the analysis and in combination with classical fab-planning methods, the flexible, modularly-constructed MIF overall concept was created for the processing and manufacturing of micro-components and parts.
Single MIF modules and elements, such as platforms, supply components, process and transport modules and adaptable cleanliness technology, have all been planned and integrated into a kit concept for devices and modules. It should be possible for individual users in the near future to generate a miniaturized MIF tailor-made to meet the needs of products, components and requirements. In particular, it should be possible to realize applications in precision, optics and medical device technologies in this way, as well as in bio-engineering and electroplating.
To attain a high conversion flexibility with elements and modules, new miniaturized interface concepts for the flow of materials, energy and information have also been developed. In the future, it should be possible to attach and operate modules and elements "plug and play"-style using standardized connections.
In the course of the speech, excerpts from the results worked on during the Fraunhofer IPA research project will be presented. The main points considered here will be the MIF overall concept, device and module kits and interfaces. Additionally, the first hardware modules and components will also be presented.