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Low-Temperature Ti-Si bonding and its application in micro-device fabrication
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2007
Conference Paper
Titel
Low-Temperature Ti-Si bonding and its application in micro-device fabrication
Author(s)
Jia, C.
Hiller, K.
Wiemer, M.
Otto, T.
Gessner, T.
Hauptwerk
Conference on Wafer Bonding for MEMS Technologies and Wafer Integration 2007. CD-ROM
Konferenz
Conference on Wafer Bonding for MEMS Technologies and Wafer Integration 2007
Language
English
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Fraunhofer-Institut für Elektronische Nanosysteme ENAS
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM