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Trends in 3D Integration of MEMS and Electronics
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2009
Conference Paper
Titel
Trends in 3D Integration of MEMS and Electronics
Author(s)
Wiemer, Maik
Braeuer, J.
Besser, J.
Geßner, Thomas
Hauptwerk
WaferBond 2009, Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration
Konferenz
Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration 2009
Language
English
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Fraunhofer-Institut für Elektronische Nanosysteme ENAS