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Progress in thermal characterisation methods and thermal interface technology within the "Nanopack" project
: Wunderle, B.; Ras, M.A.; Klein, M.; Mrossko, R.; Engelmann, G.; May, D.; Wittler, O.; Schacht, R.; Dietrich, L.; Oppermann, H.; Michel, B.
|Institute of Electrical and Electronics Engineers -IEEE-; Circuits Multi-Projets -CMP-, Grenoble; IEEE Components, Packaging, and Manufacturing Technology Society:|
THERMINIC 2009, 15th International Workshop on Thermal Investigations of ICs and Systems : Leuven, Belgium, 7 - 9 October 2009
New York, NY: IEEE, 2010
|International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) <15, 2009, Leuven>|
| Conference Paper|
|Fraunhofer ENAS ()|
As the demand for new thermal technologies and materials has been increasing over the years to provide thermal solutions to the next generation of power electronics, microprocessors and high-power optical systems also thermal characterisation methods have to keep up with the pace of this development with respect to resolution and accuracy. Within the EU-funded project ldquoNanopackrdquo we have developed both bulk and interface technologies to reduce thermal resistance using Ag-based materials and low-T and low-p processes to render them eligible for the electronics industry. New processes to generate nano-enhanced surface structures as well as thermo-compression bonding are examined within this paper. Along with these processes especially designed test stands are described which are able to extract the effects achieved by the technological advances.