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Bauteilanordnung und Verfahren zu dessen Herstellung

Method for the production of component arrangement with a first substrate having first contact element and a second substrate having second contact element, comprises applying a protective layer on the first and/or the second substrate
 
: Oppermann, H.; Klein, M.; Toepper, M.; Wolf, J.

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Frontpage ()

DE 102009009828 A: 20090219
DE 102009009828 A: 20090219
H01L0021
H01L0023
German
Patent, Electronic Publication
Fraunhofer IZM ()

Abstract
(A1) Gegenstand der Erfindung ist eine Bauteilanordnung mit einem ersten Substrat und mindestens einem auf dem ersten Substrat angeordneten zweiten Substrat, wobei das erste Substrat mindestens ein erstes Kontaktelement und das mindestens eine zweite Substrat mindestens ein zweites Kontaktelement aufweist und die Kontaktelemente jeweils eine Kontaktflaeche besitzen, welche zu jeweils einer elektrischen Kontaktierung verbunden sind und eine Stuetzschicht das erste Substrat und das mindestens eine zweite Substrat miteinander verbindet. Dabei wird waehrend der Herstellung die Stuetzschicht derart strukturiert, dass eine Teilflaeche des ersten Substrats und eine Teilflaeche des mindestens einen zweiten Substrats nicht ueberdeckt sind, wobei die Teilflaeche die jeweilige Kontaktflaeche des mindestens einen ersten und zweiten Kontaktelements umschliesst und die zwischen den Kontaktflaechen hergestellte Kontaktierung somit nicht durch die Stuetzschicht verunreinigt ist. Die Kontaktflaechen sind somit einander frei zugaenglich, ohne dass Elemente der Stuetzschicht dazwischen liegen. Hierdurch wird eine verbesserte elektrische Leitfaehigkeit bei gleich bleibender mechanischer Stabilitaet erzeugt.

 

WO 2010094511 A2 UPAB: 20100910 NOVELTY - The method for the production of component arrangement (100) with a first substrate (11) and a second substrate (12, 12') arranged on the first substrate, where the first substrate comprises a first contact element and the second substrate comprises a second contact element corresponding to the first contact element, comprises providing first and second contact elements having contact surfaces, and applying a protective layer (15, 15') on the first substrate, where the protective layer covers a part area of the first substrate. DETAILED DESCRIPTION - The method for the production of component arrangement (100) with a first substrate (11) and a second substrate (12, 12') arranged on the first substrate, where the first substrate comprises a first contact element and the second substrate comprises a second contact element corresponding to the first contact element, comprises providing first and second contact elements having contact surfaces, applying a protective layer (15, 15') on the first substrate, where the protective layer covers a part area of the first substrate and the part area of the contact surface surrounds a first contact element and/or applying a protective layer on the second substrate, where the protective layer covers the second substrate and the part area of the contact surface surrounds the second contact element, and connecting the contact surface of the first contact element with the corresponding contact surface of the second contact element for producing an electric contact. The two contacts (16, 16') are arranged and the protective layer is structured so that the part area of the first substrate and/or the part area of the second substrate form a connecting zone in which the contacts exist. A channel is formed between the protective layer and the contacts. A switching carrier or an electronic, optical or micromechanical component present in wafer assembly is arranged as first and/or as second substrate. The protective layer does not touch the electric contacts. The protective layer is applied on the first substrate and/or the second substrate. The surface of the protective layer turned away the first and/or the second substrate is applied with an adhesive and/or the protective layer is adhered. The height of the first and second contact elements before connecting the contact surfaces is smaller than the height of the protective layer and the contact surfaces are connected together by thermo compression. The protective layer of the first and second substrate connects to each other. The protective layer connects the first and the second substrate and subsequently the contact surfaces are connected together by soldering or remelting. Before connecting the contact surfaces, a gas for spraying in the channel is guided. An INDEPENDENT CLAIM is included for a component arrangement with substrates. USE - Method useful for the production of electronic component arrangement. ADVANTAGE - The method ensures production of electronic component arrangement with improved electrical conductivity with constant mechanical stability.

: http://publica.fraunhofer.de/documents/N-148775.html