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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Modeling and Analysis of a New Packaging Structure for Noise Isolation in Mixed-Signal Systems

 
: Ndip, I.; Guttowski, S.; Reichl, H.

IMAPS 2009, 42nd International Symposium on Microelectronics : Bringing Together The Entire Microelectronics Supply Chain! November 1-5, 2009 San Jose Convention Center - San Jose, California, USA
San Jose, Calif., 2009
ISBN: 0-930815-89-0
pp.46-53
International Symposium on Microelectronics <42, 2009, San Jose/Calif.>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-147522.html