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Packaging of a silicon-based biochip

: Velten, T.; Biehl, M.; Haberer, W.; Koch, T.; Ortiz, P.; Keegan, N.; Spoors, J.; Hedley, J.; McNeil, C.


Kullberg, R.C. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Reliability, packaging, testing, and characterization of MEMS/MOEMS and Nanodevices VIII. Proceedings : 28 - 29 January 2009, San Jose, California, United States
Bellingham, WA: SPIE, 2009 (SPIE Proceedings 7206)
ISBN: 978-0-8194-7452-0
Paper 720603
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices Conference <8, 2009, San Jose/Calif.>
Photonics West Conference <2009, San Jose/Calif.>
Conference Paper
Fraunhofer IBMT ()

We present a sophisticated method for the packaging of a micro-electro-mechanical biochip, which leaves the sensitive surface area of the chip uncovered to allow for direct contact to aqueous environment. Together with adequate integration in a fluidic cartridge, the packaging method allows for the realization of a lab-on-chip (LOC). A fluidic interface to the cartridge is provided as well as electrical interfaces to the biochip electronics located in a readout instrument. The biochip features a central membrane and electrodes, both located in the central chip area, and bond pads distributed along the rim of the chip. The packaging method ensures a hermetic separation between the membrane sensing area interfaced to liquids and the bond pad area. Challenging was the fact that both, the freely moving membrane and the bond pads for electrical interconnection are positioned very close to each other on the same chip surface area. We mounted the biochip into a recess of a rigid printed circuit board and electrically connected it to the latter with a proprietary MicroFlex Interconnection (MFI) technology. A customized coating method using a specially shaped silicone casting-mold ensured a very thin, hermetic encapsulation, which left the membrane safe and freely accessible.