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New electrical connection technology for microsystems using inktelligent printing® and functional nanoscaled INKS
urn:nbn:de:0011-n-1451497 (1.5 MByte PDF)
MD5 Fingerprint: 0fa49c00c05025b6270eae16b9b03c68
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Created on: 12.11.2010
|IEEE Electron Devices Society:|
TRANSDUCERS 2009 : International Solid-State Sensors, Actuators and Microsystems Conference; 21 - 25 June 2009, Denver
Piscataway, NJ: IEEE, 2009
ISBN: 978-1-4244-4193-8 (online)
ISBN: 978-1-4244-4190-7 (print)
|International Conference on Solid-State Sensors, Actuators, and Microsystems <15, 2009, Denver>|
| Conference Paper, Electronic Publication|
|Fraunhofer IFAM ()|
A new electrical connection technology for highly miniaturized systems based on functional printing has been studied. INKtelligent printingreg with its ability to print structures in micrometer size uses electrically conductive inks with functional nanoparticles to provide MEMS devices with electrical contacts. Due to large dimensions of conventional packaging technologies like flip chip or wire bonding, INKtelligent printingreg will dramatically increase size of assembled systems. Here, an aerosol beam technology - also known as Maskless Mesoscale Material Deposition (M3Dreg) or Aerosol Jetreg - is presented. Tests have been done to characterize conductivity, contact resistance, long term stability and temperature dependency as also applications with flow sensors.