Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. A novel multi pressure wafer level packaging technology
| Knechtel, R.:
WaferBond 2009, Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration : 6th - 8th December 2009, Grenoble, France ; [WaferBond '09]
Grenoble, 2009 |
| Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration <2009, Grenoble> |
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| English |
| Conference Paper |
| Fraunhofer ISIT () |