Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Investigation on thermo-mechanical reliability of flip-chip assemblies using anisotropic conductive adhesive

 
: Kallmayer, C.; Walter, H.; Aschenbrenner, R.; Michel, B.

Gessner, T.:
Smart systems integration 2010. 4th European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components. CD-ROM : Como, Italy, 23 - 24 March 2010
Berlin: VDE-Verlag, 2010
ISBN: 978-3-8007-3208-1
European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components <4, 2010, Como>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-143435.html