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Entwicklung eines Modells zur Beschreibung der radialen Normal- und Schubspannungsverhältnisse beim freien Prägen von dünnen kreisrunden Substraten aus anorganischem Glas und Ableitung möglicher Grenzen der vollflächigen Strukturierbarkeit von Wafern durch Heißprägen im nicht geschlossenem Werkzeug

 
: Gerlach, C.

Chemnitz, 2010, 113 pp.
Chemnitz, TU, Dipl.-Arb., 2010
German
Thesis
Fraunhofer IWU ()
Heißprägen; Glas; Glaswafer; Glasformgebung; Prozessmodell; Mikrostrukturierung; Mikroumformung; Replikation; Wirtschaftlichkeit; hot embossing; glass; glass wafer; glass forming; process model; microstructuring; microforming; replication; cost effectiveness

Abstract
The manufacturing of hot embossing is highly suitable for the fabrication of functional structures of high accuracy in inorganic glass wafers. As a process, hot glass embossing is still in the phase of research. Here, a process model is developed analytically, considering the radial ratio of the axial and shear stress, to describe the limit to feasible holohedral moulding of wafers in an unclosed tool. Using the developed process model, the fitting combination of the process parameters and tool geometry can be calculated for a desired wafer design without the use of empirical data. Hence the process model can be used as an instrument for the start-up of an industrial mass production of microstructured glass wafers. Hot embossing processes with a flat tool and a tool system which features a radial flow resistance are investigated. An approach for the experimental verification procedure of the process model is given. In addition the economical benefits from the process model are analysed and rules for an economical process design are established.

: http://publica.fraunhofer.de/documents/N-141521.html