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In situ imaging of hole shape evolution in ultrashort pulse laser drilling

: Döring, S.; Richter, S.; Nolte, S.; Tünnermann, A.

Postprint (1.6 MByte; PDF; )

Optics Express 18 (2010), No.19, pp.20395-20400
ISSN: 1094-4087
Journal Article, Electronic Publication
Fraunhofer IOF ()

For the first time, in situ the hole shape evolution during ultrashort pulse laser drilling in semiconductor material is imaged. The trans-illumination of the sample at a wavelength of 1.06 µm is projected onto a standard CCD camera during the ablation, providing an image of the contour of the ablated structure perpendicular to the irradiation for drilling. This demonstrated technique enables a direct, high resolution investigation of the temporal evolution of the drilling process in the depth of the material without complex sample preparation or post processing.