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2004
Book Article
Titel
The Size Effect on the Mechanical Response of Cu Microwires
Abstract
Copper microwires are prepared to obtain a bamboo structure with grain sizes similar to thickness. The samples are investigated in tensile and in fatigue tests. The data are important for the deformation characteristics of microelements often containing freestanding bond wires subjected to thermal fatigue. Bamboo structures are of particular interest because they may occur at high current densities and can be used deliberately to reduce effects of electromigration. Considering Young's modulus as an indication of texture, deformed sample material of similar texture is compared and shows monotonously increasing yield strength but decreasing fracture elongation with reduced thickness.