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2004
Book Article
Titel
First system-on-package demonstration with digital, optical and RF for broadband applications
Abstract
The Packaging Research Center (PRC) at Georgia Tech has been exploring and developing System-On-a-Package (SOP) technology with digital, RF, and optical system integration in a single microminiaturized package. The SOP aims at utilizing the best of on-chip integration by SOC and the package integration by SIP to achieve highest system performance at the lowest cost and smallest size. The multifunctional SOP package is highly integrated and fabricated on large area organic substrates similar to the wafer-to-IC concept.