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Reactive air brazing as joining technology for SOFC

Reaktives Löten an Luft als Fügetechnologie für SOFC
: Pönicke, A.; Schilm, J.; Kusnezoff, M.; Michaelis, A.

presentation urn:nbn:de:0011-n-1396674 (646 KByte PDF)
MD5 Fingerprint: d2d7d604bd50d897bf9525307689e37a
Created on: 14.12.2010

Fulltext urn:nbn:de:0011-n-139667-15 (1.9 MByte PDF)
MD5 Fingerprint: fa3ce7f7ae913586ed8ca96e9393ff78
Created on: 4.11.2014

Deutscher Verband für Schweißen und Verwandte Verfahren e.V. -DVS-:
Hart- und Hochtemperaturlöten und Diffusionsschweißen : LÖT 2010; Vorträge und Posterbeiträge des 9. internationalen Kolloquiums in Aachen vom 15. bis 17. Juni 2010 = Brazing, high temperature brazing and diffusion bonding
Düsseldorf: DVS-Verlag, 2010 (DVS-Berichte 263)
ISBN: 978-3-87155-589-3
ISSN: 0418-9639
Internationales Kolloquium Hart- und Hochtemperaturlöten und Diffusionsschweißen <9, 2010, Aachen>
International Colloquium Brazing, High Temperature Brazing and Diffusion Bonding <9, 2010, Aachen>
Conference Paper, Electronic Publication
Fraunhofer IKTS ()
reactive air brazing; Löten von Keramik und Metall; Fügen von SOFC

Reactive air brazing (RAB) is a promising technology to join metals and ceramics in air. RAB brazes in the Ag-CuO-system can be used to seal electrochemical devices like solid oxide fuel cells (SOFC). The present study focuses on the development of interfacial layers between RAB brazes and the metallic component of metalceramic-joints during thermal treatment at high temperatures. Special interest is paid on the CuO content of the RAB brazes and the type of the metallic alloy. It can be shown that certain components of the alloys and also the content of the active CuO phase in the RAB braze are responsible for the evaluation of the microstructure at the interfaces. Independent of the amount of CuO in the braze, samples brazed with the Mn containing Crofer 22 APU showed thicker oxide reaction layers at the interface than the ones with ITM-LC. The influence of the CuO content in the RAB braze on the long-term stability is also discussed.