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Verfahren zur Erzeugung metallisch kristalliner Oberflaechenstrukturen im Wege einer galvanischen Metallabscheidung

Method for producing metallic crystalline surface structure by galvanic metal deposition on an electrode surface, comprises horizontally arranging the electrode surface and a surface associated to the counter electrode
 
: Schmidt, R.; Zwanzig, M.; Fiedler, S.; Ostmann, A.; Aschenbrenner, R.

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DE 102009006282 A: 20090127
DE 102009006282 A: 20090127
C25D0007
German
Patent, Electronic Publication
Fraunhofer IZM ()

Abstract
(A1) Beschrieben wird ein Verfahren zur Erzeugung metallisch kristalliner Oberflaechenstrukturen im Wege einer galvanischen Metallabscheidung auf einer Elektrodenoberflaeche, die innerhalb einer Elektrolytfluessigkeit gegenueber einer das abzuscheidende Metall enthaltenden Gegenelektrode angeordnet wird. Die Erfindung zeichnet sich dadurch aus, dass die Elektrodenoberflaeche und eine der Gegenelektrode zuordenbare Oberflaeche horizontal derart angeordnet werden, dass die Elektroden- und Gegenelektrodenoberflaeche relativ zur Elektrolytfluessigkeit ruhen, und dass zwischen der Elektroden- und Gegenelektrodenoberflaeche eine elektrische Spannung angelegt wird, bei der sich angrenzend an die Elektrodenoberflaeche eine Schicht innerhalb der Elektrolytfluessigkeit mit einer sich orthogonal zur Elektrodenoberflaeche erstreckenden Schichtdicke ausbildet, innerhalb der sich eine Konvektionsstroemung ausbildet, die ausschliesslich durch einen von den Metallionen bedingten und orthogonal zur Elektrodenoberflaeche orientierten Konzentrationsgradienten und einem daraus resultierenden Dichtegradienten initiiert wird.

 

DE 102009006282 A1 UPAB: 20100806 NOVELTY - The method for producing metallic crystalline surface structure by galvanic metal deposition on an electrode surface that is arranged within an electrolyte fluid (3) against a counter electrode containing metal to be deposited, comprises horizontally arranging the electrode surface and a surface associated to the counter electrode in such a way that the electrode- and counter electrode surfaces rest relative to the electrolyte fluid. Electric voltage is applied between the electrode- and counter electrode surfaces in which a layer is formed within the electrolyte fluid with a layer thickness. DETAILED DESCRIPTION - The method for producing metallic crystalline surface structure by galvanic metal deposition on an electrode surface that is arranged within an electrolyte fluid (3) against a counter electrode containing metal to be deposited, comprises horizontally arranging the electrode surface and a surface associated to the counter electrode in such a way that the electrode- and counter electrode surfaces rest relative to the electrolyte fluid. Electric voltage is applied between the electrode- and counter electrode surfaces in which a layer is formed within the electrolyte fluid with a layer thickness extending itself orthogonal to electrode surface, adjacent to the electrode surface. A convection flow forms within the electrode surface and is initiated subsequently through a concentration gradient induced by metal ions and oriented orthogonal to electrode surface, and through a density gradient. Depletion induced through deposition on the electrode surface adjusts on metal ions directly at the electrode surface adjacent within the electrolyte fluid. The metal ion concentration uniformly increases with increasing orthogonal interval to electrode surface within the layer. The concentration gradient is uniformly distributed over the total electrode surface. The electrolyte fluid and/or electrode and/or counter electrode are held respectively at same temperature. The convection flow forms itself exclusively under gravity condition, and the electrode surface is oriented vertically to gravity vector. The surface of semiconductor wafer, a glass substrate or a film is used as electrode surface. A layer from electrically insulated materials is section-wisely applied on the electrode surface. The metal is heavy metal and/or its alloy, non-ferrous metal and element of subgroup such as gold and silver. The metallic crystalline surface structure rises as rib-like and steep-edge like crystallite over the planar electrode surface. The crystallite has a length of maximum 100 mu m, and a width of maximum 25 mu m on its base. The crystallite has two crystallite edges that cut itself on a crystal point or a crystalline ridge under an angle of smaller than 60 degrees C. USE - The method for producing metallic crystalline surface structure by galvanic metal deposition on an electrode surface useful for producing bonded connection. ADVANTAGE - The method ensures uniform production of metallic crystalline surface structure with improved abrasion resistance.

: http://publica.fraunhofer.de/documents/N-139524.html