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Thermal performance, mechanical reliability and technological features of different cooling concepts for high power chip modules

 
: Wunderle, B.; Schacht, R.; Wittler, O.; Michel, B.; Reichl, H.

IEEE Computer Society, Test Technology Technical Council -TTTC-:
International Workshop on Thermal Investigation [i.e. Investigations] of ICs and Systems, THERMINIC 2003. Collection of papers : Aix-en-Provence, France, 24 - 26 September 2003
Grenoble: TIMA Laboratory, 2003
ISBN: 2-8481-3020-2
pp.59-64
International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) <9, 2003, Aix-en-Provence>
English
Conference Paper
Fraunhofer IZM ()

Abstract
For optimum design of electronics cooling solutions thermal performance and thermo-mechanical reliability have to be addressed right from the beginning and on an equal footing. This entails a comprehensive approach: Virtual prototyping by FE-simulations as well as experimental verification and testing focused a priori on materials, technology and failure-related issues. In this paper we present an approach based on this principle to design reliable thermal management solutions for high power chip modules. This approach is exemplified for a closed-loop micro-channel water cooling system, where the accent is put on flip-chip reverse side cooling. A numerical parametric study is carried out for an optimisation with respect to thermal performance and thermo-mechanical reliability, where the results concerning lifetime may also be extended to air-cooled systems.

: http://publica.fraunhofer.de/documents/N-139178.html