Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Lifetime prediction of extended flip-chip packages under thermal and mechanical loading
| Zhang, Q.Q. ; European Commission; IEEE Components, Packaging, and Manufacturing Technology Society:
2nd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics 2001. Proceedings : 9 - 11 April 2001, Maison de la Chimie, Paris, France
Paris: EuropIA Productions, 2001
ISBN: 0-7803-9806-8
pp.123-128 |
| International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics (EuroSimE) <2, 2001, Paris> |
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| English |
| Conference Paper |
| Fraunhofer IZM () |