Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Lead-free solder interconnects - characterization, testing and reliability
| Ernst, L.J. ; European Commission; IEEE Components, Packaging, and Manufacturing Technology Society:
3rd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics, ESIME 2002. Proceedings : 15 - 17 April 2002, Cercle Républicain, Paris, France
Piscataway/NJ: IEEE, 2002
ISBN: 0-7803-9819-X |
| International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics (EuroSimE) <3, 2002, Paris> |
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| English |
| Conference Paper |
| Fraunhofer IZM () |