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Investigations on low cycle fatigue of electrodeposited thin copper and nickel films

 
: Dudek, R.; Walter, H.; Michel, B.; Zapf, J.

Ernst, L.J. ; IEEE Components, Packaging, and Manufacturing Technology Society:
4th International Conference on Thermal & Mechanical Simulation and Experiments in Microelectronics and Microsystems, ESIME 2003. Proceedings : March 30 - April 2, 2003, Centre de Congrès d'Aix, Aix-en-Provence, France
Piscataway, NJ: IEEE, 2003
ISBN: 0-7803-7054-6
International Conference on Thermal & Mechanical Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <4, 2003, Aix-en-Provence>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-139146.html