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Comparison of lifetime predictions with 3D finite element models of a high density flip chip without underfill on LTCC
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2003
Conference Paper
Titel
Comparison of lifetime predictions with 3D finite element models of a high density flip chip without underfill on LTCC
Author(s)
Spraul, M.
Nüchter, W.
Möller, A.
Schubert, A.
Michel, B.
Hauptwerk
4th International Conference on Thermal & Mechanical Simulation and Experiments in Microelectronics and Microsystems, ESIME 2003. Proceedings
Konferenz
International Conference on Thermal & Mechanical Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 2003
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM