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a46Parametric FE-approach to flip chip reliability under various loading situations

 
: Wunderle, B.; Nüchter, W.; Schubert, A.; Michel, B.; Reichl, H.

Ernst, L.J. ; European Commission; IEEE Components, Packaging, and Manufacturing Technology Society:
3rd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics, ESIME 2002. Proceedings : 15 - 17 April 2002, Cercle Républicain, Paris, France
Piscataway/NJ: IEEE, 2002
ISBN: 0-7803-9819-X
International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics (EuroSimE) <3, 2002, Paris>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-139127.html