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1991
Journal Article
Title
MBE overgrowth of implanted regions in InP:Fe substrates
Abstract
The MBE growth of InGaAs layers on Si-implanted InP:Fe substrates was investigated. Ion doses and energies used were in the range of 5*1012-5*1014 cm-2 and 100-700 keV, respectively. Among the different annealing conditions tested, i.e. in-situ annealing in the MBE growth chamber at 500 degrees C, rapid thermal annealing at 650 degrees C, and high temperature annealing at 750 degrees C under PH3/H2 partial pressure, only the latter method was found to ensure restoration of the substrate crystal and high-quality overgrowth as assessed by RHEED and X-ray diffractometry. Heterojunction bipolar transistors employing an implanted overgrown collector was successfully fabricated.
Keyword(s)
annealing
gallium arsenide
heterojunction bipolar transistors
iii-v semiconductors
incoherent light annealing
indium compounds
ion implantation
iron
molecular beam epitaxial growth
semiconductor doping
semiconductor growth
silicon
substrates
ion doses
ion energies
MBE overgrowth
implanted regions
annealing conditions
MBE growth chamber
rapid thermal annealing
high temperature annealing
substrate crystal
high-quality overgrowth
RHEED
x-ray diffractometry
implanted overgrown collector
500 to 750 degc
100 to 700 kev
InGaAs layers
Ph2-H2
H2