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Measurement of Thermal Expansion in Micromaterials - cTest Microscopy

: Kühnert, R.; Tränkner, K.; Herrmann, A.; Vogel, D.; Michel, B.

Materials Week 2000. Proceedings
Frankfurt: Werkstoffwoche-Partnerschaft GbRmbH, 2000
Materials Week <2000, München>
Conference Paper
Fraunhofer IZM ()

For a comprehensive analysis of the thermomechanical deformation and failure behaviour of microelectromechanical systems and components the reliable knowledge of valid material law and appropriate material parameters is required.
E.g., for the numerical modelling of thermal mismatch problems in interfaces regions of materials with different thermal expansion behaviour the coefficients of thermal expansion (CTE) have to be known with high precision.
To determine thermal parameters experimentally several standard methods are available like dilatometry (DIL), static thermomechanical analysis (TMA), or dynamic mechanical analysis (DMA). In case of micromaterials the application of these techniques can be limited because of the microscopic specimen dimensions.
For these problems a measuring method can be used where the thermal deformation of the specimen is recorded as image sequence by means of a digital microscope and evaluated by the application of digital image correlation algorithms (DIC).
In the paper current results with regard to the realization of the approach in the CTE microscope cTest are presented.