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Interfacial Crack Evaluation by Means of FE-Compatible Image Matching

: Kühnert, R.; Franke, H.; Meyer, R.; Schubert, A.; Auersperg, J.

Materials Week 2000. Proceedings
Frankfurt: Werkstoffwoche-Partnerschaft GbRmbH, 2000
Materials Week <2000, München>
Werkstoffwoche <3, 2000, München>
Conference Paper
Fraunhofer IZM ()

Today microsystem technologies are incorporated in nearly all fields of manufacturing industrial and consumer products. Beside the optimization of microtechnologies with regard to the relative costs resulting from their application, the reliability in particular is the most decisive factor for the acceptance to potential users.
For this reason, R&D projects are increasingly concerned with the analysis of thermomechanical behaviour of components, electronic packages, and microelectromechanical systems (MEMS).
Due to the large number of influencing factors (e.g. thermal mismatch, localized stresses, material inhomogeneities) especially questions of modeling of material behaviour and appropriate reliability criteria as well as failure models are challenging objectives of this research work.

In this paper current research activities dealing with the problem of interface crack evaluation in COB arrangments are described. An important part is the verification of analytical and numerical models of deformation behaviour and crack propagation at material interfaces using a novel finite-element-compatible image matching technique and its reproducible realization by means of the mTest system that represents commercially available micromaterial testing equipment.