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Adhesion of moulding compounds. Can material pre-selection increase the reliability of electronic components?

 
: Pufall, R.; Michel, B.; Kaulfersch, E.

Laudon, M. ; Nano Science and Technology Institute -NSTI-:
Nanotechnology 2010. Technical proceedings of the NSTI Nanotechnology Conference and Expo - Nanotech Conference & Expo. Vol.2: Electronics, devices, fabrication, MEMS, fluidics and computational : An interdisciplinary integrative forum on nanotechnology, biotechnology and microtechnology; June 21 - 24, 2010, Anaheim, California, U.S.A
Boca Raton, Fla.: CRC Press, 2010
ISBN: 978-1-4398-3402-2
ISBN: 1-4398-3402-4
ISBN: 978-1-439-83418-3
pp.1-4
Nanotechnology Conference and Expo <2010, Anaheim/Calif.>
English
Conference Paper
Fraunhofer IZM ()

Abstract
It is well known that high temperature storage can degrade moulding compounds for chip encapsulation to such an extent that the adhesions to surfaces like copper (lead frames) or polyimide (chip coating) decreases drastically causing delamination. Also during normal operation of electronically components heat is generated locally (bond wire, or chip surface) degrading the moulding compound and reducing the adhesion which in extreme cases can destroy the metallisation or bond wires.

: http://publica.fraunhofer.de/documents/N-137131.html