Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Multi fiber/chip coupling and optoelectronic integrated circuit packaging based on flip chip bonding techniques

: Weber, R.; Fidorra, F.; Hamacher, M.; Heidrich, H.; Jacumeit, G.

	Chen, R.T. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.: Optoelectronic interconnects : 18 - 20 January 1993, Los Angeles, California Bellingham/Wash.: SPIE, 1993 (SPIE Proceedings Series 1849) ISBN: 0-8194-1075-6 pp.149-152
	Conference "Optoelectronic interconnects" <1993, Los Angeles/Calif.>

	English
	Conference Paper
	Fraunhofer HHI ()
	flip-chip devices; iii-v semiconductor; indium compounds; integrated optoelectronics; multichip module; optical couplers; optical fibre; packaging; multi fiber/chip coupling; optoelectronic integrated circuit packaging; flip-chip bonding; passive fiber alignment; V-groove; integrated InP device

Abstract
For the packaging of integrated InP devices the authors present two approaches, which rely on a passive fiber alignment. In one case the fibers are hold in V-grooves etched directly into the InP, alternatively, V-grooves are etched into Si and the InP chip is assembled by a self-aligning flip chip process.