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Lead-free flip-chip solder interconnects - materials mechanics and reliability issues

 
: Schubert, A.; Dudek, R.; Walter, H.; Jung, E.; Gollhardt, A.; Michel, B.

Micromaterials and nanomaterials 1 (2001), pp.12-25
ISSN: 1619-2486
Workshop Micro Materials Testing and Simulation <1, 2001, Döllnsee>
English
Journal Article, Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-134044.html