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Advanced adhesives based on carbon nanotube technology

 
: Fecht, H.-J.; Leson, A.; Michel, B.; Werner, M.

Gessner, T. ; MESAGO Messe Frankfurt GmbH, Stuttgart:
Smart systems integration 2008 : 2nd European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components, Barcelona, Spain, 9 - 10, April 2008
Berlin: VDE-Verlag, 2008
ISBN: 978-3-8007-3081-0
ISBN: 3-8007-3081-2
pp.161-164
European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components <2, 2008, Barcelona>
English
Conference Paper
Fraunhofer IZM ()

Abstract
For microsystems packaging and system integration new processing techniques are being developed on the basis of advanced composites using nanoscale building blocks - here carbon nanotubes - incorporated in relevant interconnect materials, such as metallic solders and highly conductive polymer based adhesives.

: http://publica.fraunhofer.de/documents/N-134027.html