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Hybrid micro-optical system integration by laserbeam soldering

: Beckert, E.; Eberhardt, R.; Banse, H.; Tünnermann, A.; Buchmann, F.; Fettke, M.


Pfleging, W. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Laser-based micro- and nanopackaging and assembly : 22 - 24 January 2007, San Jose, California, USA
Bellingham, WA: SPIE, 2007 (SPIE Proceedings Series 6459)
ISBN: 978-0-8194-6572-6
Paper 645904, 8 pp.
Conference "Laser-Based Micro- and Nanopackaging and Assembly" <2007, San Jose/Calif.>
Conference Paper
Fraunhofer IOF ()

Longterm stable and high precise interconnections between small optical components and the optomechanical platform are mandatory for the assembly of complex and miniaturized optoelectronical systems. The approach discussed in this paper is to integrate optics and electronics on a common platform that is a ceramic Printed Circuit Board with embedded mounting structures for easy passive alignment of the optical components. Active alignment with higher accuracy can also be used, in both cases laserbeam soldering is the preferred and precise joining technology. Thin solder layers as well as solder bumps are used to create joints with an accuracy < +/- 0.5 mu m, suitable for singlemode coupling applications.