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Optoelectronic packaging based on laser joining

: Eberhardt, R.; Beckert, E.; Burkhardt, T.; Böhme, S.; Schreiber, T.; Tünnermann, A.


Pfleging, W. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Laser-based micro- and nanopackaging and assembly II : 22 - 24 January 2008, San Jose, California, USA
Bellingham, WA: SPIE, 2008 (SPIE Proceedings Series 6880)
ISBN: 978-0-8194-7055-3
ISSN: 0277-786X
Paper 68800G, 10 pp.
Conference "Laser-Based Micro- and Nanopackaging and Assembly" <2, 2008, San Jose/Calif.>
Conference Paper
Fraunhofer IOF ()

Laser based joining technologies for optical assemblies overcome the limitations of standard fixation technologies such as adhesive or wafer level bonding. By applying the laser energy locally and for a limited time these technologies enable for higher stability of optical joints as well as additional functionality. Working without intermediate layers laser splicing creates highly stable transparent joints that are suitable for the transmission of high power, e.g. in fiber laser assemblies. In contrast, laser beam soldering of optical components as an alternative with a metallic intermediate layer is non-transparent, but creates flexible and stress-compensating joints as well as thermal and electrical interconnects.