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Submicron accuracy optimization for laser beam soldering processes

 
: Beckert, E.; Burkhardt, T.; Hornaff, M.; Kamm, A.; Scheiding, I.; Stiehl, C.; Eberhardt, R.; Tünnermann, A.

:

Pfleging, W. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Laser-based micro- and nanopackaging and assembly IV : 26 - 28 January 2010, San Francisco, California, United States; Conference LBMP-IV as part of LASE 2010 at Photonics West
Bellingham, WA: SPIE, 2010 (Proceedings of SPIE 7585)
ISBN: 978-0-8194-7981-5
Paper 758505
Conference "Laser-Based Micro- and Nanopackaging and Assembly" (LBMP) <4, 2010, San Francisco/Calif.>
Photonics West Conference <2010, San Franciso/Calif.>
English
Conference Paper
Fraunhofer IOF ()
micro assembly; soldering; solderjet bumping; solder jetting; lead-free

Abstract
Laser beam soldering is a packaging technology alternative to polymeric adhesive bonding in terms of stability and functionality. Nevertheless, when packaging especially micro optical and MOEMS systems this technology has to fulfil stringent requirements for accuracy in the micron and submicron range. Investigating the assembly of several laser optical systems it has been shown that micron accuracy and submicron reproducibility can be reached when using design-of-experiment optimized solder processes that are based on applying liquid solder drops ("Solder Bumping") onto wettable metalized joining surfaces of optical components. The soldered assemblies were subject to thermal cycles and vibration/ shock test also.

: http://publica.fraunhofer.de/documents/N-133191.html