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Smart power integration on SOI: thin and thick film (local) SOI processes and devices

: Paschen, U.; Weyers, J.; Bentum, R. van; Steck, B.; Vogt, F.P.; Vogt, H.

Lorenz, L.:
CIPS 2000. International Conference on Integrated Power Systems : June 20-21, 2000, Bremen, Germany
Berlin: VDE-Verlag, 2000 (ETG-Fachbericht 81)
ISBN: 3-8007-2560-6
pp.20-29 : Lit.
International Conference on Integrated Power Systems <1, 2000, Bremen>
Conference Paper
Fraunhofer IMS ()
local SIMOX; trench isolation; SIMOX-Technologie; Smart-power-Technik; SOI-Technologie

Increasing requirements for power systems with regard to functionality, performance and reliability demand the integration of power devices and control circuitry together in one chip. One promising technique to integrate quasivertical or vertical power devices and intelligent drive and control circuits is by employing Silicon-on-Insulator (SOI) material. In this paper we discuss several methods to produce (local) SOI wafers as a prerequisite for advanced smart power processes. We then present two versatile process schemes based on thin and thick film SOI and briefly describe application examples.