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Full wafer microlens replication by UV imprint lithography

 
: Schmitt, H.; Rommel, M.; Bauer, A.J.; Frey, L.; Bich, A.; Eisner, M.; Völkel, R.; Hornung, M.

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Preprint urn:nbn:de:0011-n-1314919 (1.1 MByte PDF)
MD5 Fingerprint: dd6e5ae0ec1ffe3c9e761de723f30d6f
Created on: 9.9.2010


Ronse, K.:
The 35th International Conference on Micro- and Nano-Engineering, MNE 2009 : September 28 -1 October, 2009, Ghent, Belgium
Amsterdam: Elsevier, 2010 (Microelectronic engineering 87.2010, Nr.5-8)
ISSN: 0167-9317
pp.1074-1076
International Conference on Micro and Nano Engineering (MNE 2009) <35, 2009, Ghent>
English
Conference Paper, Journal Article, Electronic Publication
Fraunhofer IISB ()
microlens imprint lithography; microlens; wafer level camera; UV nanoimprint lithography

Abstract
The fabrication of microlenses is of great interest for several applications in the field of optics like wafer level cameras, homogenization of light, and coupling of light into glass fibers. Especially for low-cost optical products, microlenses have to be fabricated with a high throughput at an adequate quality. One way to fulfil these requirements is the patterning of microlenses by UV imprint lithography (UV-IL). Within this work, microlenses were replicated into the UV curing material PAK-01 by step and stamp UV-IL on silicon substrates with a diameter of 150 mm. The resulting substrates were used as masters to cast PDMS templates. These PDMS templates can be used for high throughput full wafer UV-IL Additionally, quartz substrates with a diameter of 100 mm were patterned which could be directly used as so called "optowafers". Master and patterned microlenses were inspected by scanning electron microscopy and with a white light profilometer. The results clearly demonstrate the excellent quality of the replication process and the capability of UV-IL to pattern microlenses on full wafer level for high throughput applications.

: http://publica.fraunhofer.de/documents/N-131491.html