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1998
Conference Paper
Titel
Opto-electronic packaging for broadband high speed (40 Gb/s) optical demultiplexer chip
Abstract
Summary form only given. We described a simple, quick, robust, and reusable opto-electronic packaging method for devices with narrow-spaced fibers for use in laboratory test beds and field tests.
Tags
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chip scale packaging
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demultiplexing equipment
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high-speed optical techniques
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integrated optoelectronics
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optical communication equipment
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opto-electronic packaging
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broadband high speed optical demultiplexer chip
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reusable opto-electronic packaging method
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narrow-spaced fibers
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laboratory test beds
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field tests