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Opto-electronic packaging for broadband high speed (40 Gb/s) optical demultiplexer chip

: Rosin, T.; Bornholdt, C.; Hoffmann, D.; Burghardt, R.


IEEE Lasers and Electro-Optics Society:
LEOS '98. 11th Annual Meeting. Conference proceedings. Vol. 2
S.l.: IEEE, 1998
IEEE Lasers and Electro-Optics Society (Annual Meeting) <11, 1998, Orlando/Fla.>
Conference Paper
Fraunhofer HHI ()
chip scale packaging; demultiplexing equipment; high-speed optical techniques; integrated optoelectronics; optical communication equipment; opto-electronic packaging; broadband high speed optical demultiplexer chip; reusable opto-electronic packaging method; narrow-spaced fibers; laboratory test beds; field tests

Summary form only given. We described a simple, quick, robust, and reusable opto-electronic packaging method for devices with narrow-spaced fibers for use in laboratory test beds and field tests.