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MEMS Modular Packaging and Interfaces

: Schünemann, M.; Jam, A.K.; Großer, V.; Leutenbauer, R.; Bauer, G.; Schäfer, W.; Reichl, H.


Electronic Components, Assemblies, and Materials Association; IEEE Components, Packaging, and Manufacturing Technology Society:
ECTC 2000. Proceedings of the 50th Electronic Components & Technology Conference : May 21 - 24, 2000, Las Vegas, Nevada, USA
Piscataway, NJ, USA: IEEE Press, 2000
ISBN: 0-7803-5908-9
ISBN: 0-7803-5909-7
ISBN: 0-7803-5910-0
ISBN: 0-7803-5911-9
Electronic Components and Technology Conference (ECTC) <50, 2000, Las Vegas/Nev.>
Conference Paper
Fraunhofer IPA ()
MEMS; Schnittstelle; Halbleiter

Many industrial branches other than automotive industry may benefit from MEMS technology. Most of them require custom-designed MEMS in mid-scale volumes, which are at present not available at acceptable costs. A modular MEMS packaging and interface concept may contribute to less costly solutions with faster time to market. A 3D stackable packaging concept, the Top-Bottom Ball Grid Array TB-BGA, which includes electric, fluidic, optic, and communication interfaces, is proposed. Several realization technologies (LTCC, 3D-BGA, StackPack) as well as first applications are discussed.