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2000
Conference Paper
Titel
MEMS Modular Packaging and Interfaces
Abstract
Many industrial branches other than automotive industry may benefit from MEMS technology. Most of them require custom-designed MEMS in mid-scale volumes, which are at present not available at acceptable costs. A modular MEMS packaging and interface concept may contribute to less costly solutions with faster time to market. A 3D stackable packaging concept, the Top-Bottom Ball Grid Array TB-BGA, which includes electric, fluidic, optic, and communication interfaces, is proposed. Several realization technologies (LTCC, 3D-BGA, StackPack) as well as first applications are discussed.